Principal Design and Process Engineer (MEMS)
JOB AD: Job Context: - Develop MEMS (Micro-Electro-Mechanical System) device product for the rapidly growing fields of optical fiber communication and LIDAR (Light Detection and Ranging). - Build MEMS design expertise and manufacturing capabilities in Feasibility study and simulation, Design & layout, process development, micro-assembly & packaging, optical and mechanical parameters test & reliability. Main Responsibilities: - Design, Process and Packaging of 1D&2D MEMS Micromirror & Array for Optical Fiber Communication and LIDAR. - Develop automated system for testing MEMS wafer and chip with high precision. - The automated test system includes wafer probers, optomechanical fixtures, advanced optical measurement instruments, electronic hardware, and customized test software using advanced algorithms. - Maintaining up-to-date knowledge in areas of expertise and using the knowledge to promote continuous improvement in the work - Liaising with other colleagues in Huawei. - Any other ad hoc duty as requested by the Project Manager. Essential Skills/Qualifications: - Research and development experience in MEMS device design&layout. - The experience in the areas of lithography, etching and bonding for effective and meaningful partnerships with MEMS foundries, ultimately leading to higher quality and reliability. - In-depth knowledge of semiconductor wafer processing technology for MEMS chip fabrication. - Have the capability of studying the new technology. - Demonstrable experience of teamwork.